Micro-electroplating involves the electro-chemical deposition of metallic layers on objects. In combination with optical lithography, various metallic microstructures can be produced (so-called LIGA ("Lithographisch-Galvanische Abformung") process using lithography, electroplating and moulding). In this approach a negative form of the desired metal structure is generated by means of lithography in a photo-sensitive film (photoresist). In the next technological step electroplating is used to fill metal into the empty spaces in this form, which then form a secondary structure (the desired metal structure). To achieve this, different electrolytes are used according to specific requirements: nickel, hard nickel, nickel alloys and copper. Micro-electroplating processes are available at the Research Centre for Microtechnology for the electrodeposition of copper layers and nickel layers with thicknesses up to several millimetres. Undercoating layers and start layers for electrodeposition are generated by means of a sputter process.
Production of work pieces without a mask is possible in connection with laser structuring.
- Production of structured Ni and Cu parts
- Substrate size: 4"
- Substrate thickness: max. 2 mm
- Max. layer thickness up to approx. 2 mm
- Aspect ratio (height / width) up to 6
- Electrodeposition rate: 6 µm/h
Fields of application
- Form and mint applications
- Electrodes for micro-erosion
- Masks for laserablation
- Metallic micro-prefabricated parts
- UV -LIGA technology