Laser Ablation
Laser ablation is the general term for material removal by means of laser radiation. Laser material processing enables high quality cutting, drilling or surface structuring of various materials nearly without any geometrical limitations.
The laser as a mass less tool is not subjected to wear and tear and, depending on the laser parameters, nearly every material like diamond, sapphire, brittle or very soft materials can be processed.
Lasersystems at the Vorarlberg University of Applied Sciences: UV - IR, far IR
- Excimerlaser (193 nm, 25 ns): cutting, drilling, 3D-structuring, exposure
- Ultrashort-pulsed DPSS-laser (1035 nm SH & TH, 350 fs): cutting, drilling, 3D-structuring
- CO2- Laser (10.6 µm, cw): cutting, engraving, marking, resist removal
Services
- Laser processing of metals, ceramics, glasses, polymers, crystals (diamond, sapphire,..), biological materials
- feasibility studies
- preliminary tests (cutting, drilling, structuring,.)
The laser systems at the research centre for microtechnology allow experiments with a wide range of parameters. These are wavelengths ranging from the deep UV up to the far infrared as well as different pulse durations from femtosecond and nanoseconds up to cw-radiation. This gives the opportunity to carry out comparative studies for manifold applications.
Additional to the laser sources the research centre is equipped with state-of the art measuring devices (SEM, optical microscopes, white-light interferometer et al) which could be used without restrictions allowing best experimental conditions.
