Sputtering is a method for PVD coating of substrates in a vacuum environment.

To deposit sputter coatings the coating material is placed inside a vacuum coating system as a solid “target”. Argon plasma is ignited in the vacuum chamber with the target as anode of the plasma discharge. This leads to a heavy bombardment of the target surface with Argon ions. As a consequence material is sputtered from the target surface into gaseous phase, from which it condensates on the substrate surface. One major advantage of the sputter deposition method is the ability to coat substrates at low process temperatures.

Coating system at RCMT


Fields of application

Contact person research centre Microtechnology

Stephan Kasemann

Dr. Stephan Kasemann
PVD coating and dry etching

 +43 5572 792 7209

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The research centre Microtechnology at FH Vorarlberg