Micro- and Nanotechnology 2

Basic knowledge in engineering (BSc in mechatronics, software and information engineering).

Based on the fundamentals from the previous semester, the second semester focuses on additional micro structuring techniques as well as the necessary measurement and characterization techniques.

The second semester covers the following topics in detail:

• Laserablation
• Thermal oxidation
• Chemical wet etching
• Anisotropic dry etching
• Various measurement and characterization techniques

• Introduction to the vast field of semiconductor technology (manufacturing of Integrated Circuits)
• Overview of micro lithography methods (copying structures from the design layer to the substrate surface using mask projection techniques)
• Overview of structure transfer processes (subtractive and additive methods in micro structuring)
• Overview of the most relevant metrology, measurement and characterization techniques for microtechnology.
• "Hands on" course in a cleanroom

Theoretical course with subsequent laboratory exercises after each topic 

Exam

Target audience: Students in the fields of electrical engineering, communications engineering, control engineering, automation engineering, software and information engineering who want to get an introduction to the extensive field of micro technology, semiconductor technology and micro structuring methods. Offered is a substantiated overview of this sector, which may well serve as a solid basis for a future specialization.

Scripts, chapters from Books, e.g.

• Chen, Wai-Kai (ed.): (2007): The VLSI handbook. 2nd ed. Boca Raton, FL: CRC/Taylor & Francis (= The electrical engineering handbook series).
• Helbert, John N. (ed.): (2001): Handbook of VLSI microlithography: principles, technology, and applications. 2nd ed. Norwich, NY: Noyes Publications/William Andrew Pub.
• Madou, Marc J (2002): Fundamentals of microfabrication: the science of miniaturization. Boca Raton: CRC Press.

Courses / Lectures